ALBANY, N.Y.–(Business Wire)–
Celebrating 70 years of innovation in silicone technology, Momentive Performance
Materials introduced a broad array of silicone-based thermal management
solutions at Thermal Engineering 2010 (Techno-Frontier 2010), which is Japan`s
only specialized exhibition on heat management, held July 21-23 in Tokyo.
Developed to help solve thermal challenges in high-performance electronic
components manufactured by the consumer electronics, automotive and
semiconductor industries, the new Momentive products can offer optimal thermal
conductivity, processability and long-term reliability. The product lines
featured at the show included:
* TIA Thermal Gels ─ a line of liquid-dispensed materials for heat dissipation,
available in a variety of thermal conductivity levels, viscosities and curing
profiles to meet a wide range of design needs. The new gels (TIA130G, TIA221G,
TIA216G and TIA208G) are easy to use, can be cured at room temperature, can
conform to complex shapes and non-planar surfaces, and can help provide stress
relief due to their soft properties.
* TIS Curable Thermal Compounds ─ a selection of room temperature curing
compounds to be considered for use in minimizing thermal resistance in
electronic assemblies, including the newly launched TIS380C and TIS480C-L. As
soft Thermal Interface Materials (TIMs), these thermally conductive compounds
can help provide stress relief for delicate components and extremely low bleed.
* TIG Thermal Greases ─ greases used as thermal interfaces in electronic
assemblies. This product line expanded with the introduction of TIG300BX and
TIG400BX, both of which can offer high thermal conductivity and minimized bleed.
* TIA Thermal Adhesives ─ a family of silicone heat and room temperature cure
adhesives, including the newly introduced TIA600R, a heat cure adhesive with
very high thermal conductivity, and TIA320R, a heat cure adhesive that can help
provide the added benefit of reduced scratching to delicate substrates.
* Polartherm* Boron Nitride Thermal Fillers─ a family of highly thermally
conductive and electrically insulative fillers that can add these functions to
polymers when mixed. The fillers are available in platelet, agglomerate and
spherical form to fit development needs.
* Highly Thermally Conductive Graphite Materials ─
* TPG* – graphite based material with thermal conductivity of 1500W/mK (in-plane
direction).
* TC1050* hybrid material – metal encapsulated TPG that can provide high thermal
conductivity, endurance and ease of use.
“Increases in device performance and features, coupled with component
miniaturization, continue to make thermal management a critical issue for the
electronic and microelectronic industry,” said Mr. Nobuyuki Nishiwaki, Global
Marketing Director of Consumer Electronics at Momentive. “We are pleased to
offer a comprehensive range of thermal management solutions to help
manufacturers increase the performance and longevity of their products.”
To find out more about Momentive`s solutions for the electronics industry,
please call 800.295.2392 in North America (+607.786.8131 everywhere else) or
visit www.momentive.com.
About Momentive Performance Materials
Momentive is a global leader in silicones and advanced materials, with a 70-year
heritage of being first to market with performance applications for major
industries that support and improve everyday life. The company delivers
science-based solutions, by linking custom technology platforms to opportunities
for customers. Momentive Performance Materials Inc. is controlled by an
affiliate of Apollo Management, L.P. Additional information is available at
www.momentive.com.
* Polartherm, TPG and TC1050 are trademarks of Momentive Performance Materials
Inc.
Momentive Performance Materials
Media-Americas
Nancy Pitts, +001-203-801-0836
Nancy.Pitts@momentive.com
or
Media-Europe, Middle East & Africa
Fabienne Verrey-Kalaidjian, +41 (0) 22 792 2856
Fabienne.Verrey-Kalaidjian@momentive.com
or
Media-Asia/Pacific
Joyce Sun, +86-21-3860 4706
Joyce.Sun@momentive.com
Copyright Business Wire 2010