KUALA LUMPUR, Malaysia–(Business Wire)–
Unisem today announced the introduction of a new high density leadframe
packaging technology, the Leadframe Grid Array (LFGA). This latest offering,
developed by TL Li, the founder and major shareholder of QPL International
Holdings Limited (“QPL”), and pending for patent, is a solution that offers I/O
densities traditionally only found in ball grid array packages, yet it uses a
much more cost effective material set.
As consumer electronics continue to become more and more complex, semiconductor
manufacturers also continue to push the demand for a reduced cost packaging
solution. The LFGA package provides the best of both worlds with a high density,
fully populated array of I/O`s attached to a leadframe based on their patented
leadframe design and etched leadframe process. In fact the routing density of
the LFGA makes it a great replacement for a 2 layer FBGA package.
Other key benefits of the LFGA package are its shorter bond wire lengths
compared to standard QFN packaging which not only helps improve the electrical
performance, but also helps to reduce material costs. Package footprint
reduction is also benefit with the LFGA package`s ability to take a 10×10, 72
lead QFN package down to 5.5 squared body size. Finally, the LFGA offers a
higher MSL level due to the absence of organic materials in the interface of
mold compound and leadframe.
“I believe this is another sensational invention after the QFN package that
currently dominates the packaging world. This package offers a better footprint
with higher IO density, and better thermal and electrical performance. It is
also thinner with higher IO and most importantly, offers a much better yield at
front end assembly”, stated TL Li, the founder and major shareholder of QPL, who
is also its chairman and one of its executive directors.
“We are very excited about the LFGA packaging technology our development teams
have created with this technology developed by TL Li”, stated C.H. Ang, Group
COO of the Unisem Group. “We have seen a definitive market need for a higher
I/O, lower cost packaging solution and the LFGA package meets this requirement
perfectly”, continued Ang.
The LFGA package is available now in small quantities for customer evaluation.
Unisem is a global provider of semiconductor assembly and test services for many
of the world`s most successful electronics companies. Unisem offers an
integrated suite of packaging and test services such as wafer bumping, wafer
probing, wafer grinding, a wide range of leadframe and substrate IC packaging,
wafer level CSP and RF, analog, digital and mixed-signal test services. Our
turnkey services include design, assembly, test, failure analysis, and
electrical and thermal characterization. With approximately 9,000 employees
worldwide, Unisem has factory locations in Ipoh, Malaysia; Wales, United
Kingdom; Chengdu, People`s Republic of China; Batam, Indonesia and Sunnyvale,
USA. The company is headquartered in Kuala Lumpur, Malaysia. For more
information about Unisem, please visit www.unisemgroup.com.
Chris Stai, 408-331-7325
Copyright Business Wire 2010